Windshield and Rearview Mirror Systems

Automotive windshield systems are rapidly evolving from the three basic functions: wipers, washers, and defrost. Silicon Labs’ C8051F5xx helps modernize these functions with features such as CAN, LIN or other serial networking to reduce wiring harness weight and cost as well as opening the design for new features, including efficient motor control for wiper and fluid pump motors which is especially important for vehicle electrification in mild hybrids with stop/start functionality and HEV/EVs.

The rearview mirror is becoming an increasingly complex system (compass, outside temperature, rain sensing, and glass dew point/condensation detecting). Silicon Labs’ Si114x is ideal for motion detection associated with rain on the glass, day or night. Coupled with the C8051F5xx MCU, the system provides the interface, control and data for rain detection, outside temperature, glass condensation, compass sensors and automated HVAC windshield defrost.

*Isolated drivers can be used when system noise needs to be reduced or minimized

Solutions for Windshield and Rearview Mirror Systems


Silicon Labs Solutions   Customer Benefits

Human-Machine Interface: Industry’s most sensitive active infrared proximity sensor IC to enable touchless human interface applications

Implement extended range infrared motion sensing with unusually low power levels

Precision Processing: Microcontroller with embedded CAN/LIN interface, AEC-Q100 qualified

Easily implement industry standard CAN/LIN connectivity

Human Interface Capabilities: Low power MCU with capacitive sensing, wake-on-touch, and LED lighting control

Enables stylish and differentiated user interfaces

Reliable, Safe and Effective Isolation and Power: Combines an isolator and two independent drivers into a single package with ultra-fast 50 ns propagation delays for better timing margins, safety certified to 5.0, 3.75 or 2.5 kVrms and withstand ±1500 VDC between outputs for dual drivers; CSA, VDE and UL certified, AEC-Q100 qualified

High integration, low propagation delay, small PCB footprint, flexibility, and cost-effectiveness ensure rock-solid operation over temperature and time, and unparalleled size and cost benefits