IoT product developers are under constant pressure to reduce time to market. Being first to market with a new connected product can provide first-mover advantages, but developers should not compromise on key aspects to achieve that goal. That’s a big part of why we launched xGM210x Series 2 pre-certified modules. Developers can accelerate time to market by several months when they take advantage of highly integrated modules that come complete with global regulatory certifications and important, brand protecting features such as device security.
Simplifying IoT Development
Series 2 Modules enable faster and easier IoT development for smart building, industrial IoT, and smart lighting applications. Designed to optimize the performance of resource-constrained IoT products without requiring functionality tradeoffs, the Series 2 portfolio decreases the time, cost, and risk factors through the availability of a suite of development tools including the Simplicity Studio design environment, software stacks that have a proven track record in large deployments, support personnel, and security capabilities integrated into the modules.
Securing IoT Wireless Devices
The enhanced security features, implemented in the Series 2 modules, enable developers to use modern and highly robust security features in their IoT products.
Taking Advantage of the xGM210P
xGM210P is a broad-based module optimized for line powered IoT applications in smart home, building automation, and industrial IoT. With a long RF range, dedicated security core, and large flash memory, the broad-based module is perfect for smart HVAC, building, and factory automation systems.
When integrating the xGM210P, the high temperature rating of up to 125°C allows the module to function in demanding environmental conditions such as solar baking in utility meter applications. The module’s low profile also makes it perfect for space-constrained IoT designs particularly in smart home applications including smart light bulbs, fixtures, LED strips, dimmers, fire alarms, and power sockets.
Optimizing Smart Lighting with xGM210L
The xGM210L is designed and built for smart LED bulbs and allows developers to add wireless connectivity to LED light bulbs in an easier fashion. One key optimization is the inclusion of a 6-pin header, which enables horizontal and vertical mounting, an interface for power, and pulse width modulation (PWM) for LED temperature and dimming control. The 125°C high temperature rating ensures correct operation despite the harsh operating conditions and compliance with California Title 20 ensures low power reduces wasted power. Developers can design dimmable, color tunable smart LED lightbulbs that support Bluetooth mesh, Thread, Zigbee or multiprotocol connectivity. Extensive global regulatory certifications make developing with the xGM210L cost-efficient through saving development cycles. By enabling smart lighting with robust, scalable mesh networking, consumers can control lights through a smartphone and adjust lighting settings while away from their home.To learn more about how our new Series 2 Modules can reduce development cost and accelerate time-to-market for your IoT designs, visit our Series 2 Module page.
Recently, Tom R. Halfhill, a senior analyst at The Linley Group and a senior editor of Microprocessor Report, contributed a review of our new Wireless Gecko Series 2 SoCs in the June issue of Microprocessor Report. He analyzes key EFR32 Series 2 upgrades and how the next-generation portfolio compares with the EFR32 Series 1 family in areas such as wireless performance, security features, on-chip CPU and package size.
In this report, Halfhill highlights Series 2 security features such as secure boot with Root of Trust and Secure Loader (RTSL) in addition to hardware crypto accelerations with side-channel countermeasures that considerably strengthen resistance to adversary attacks. The report also compares key specifications of EFR32MG21 and EFR32BG21 SoCs, the first products in the Series 2 portfolio. EFR32MG21 supports multiprotocol, Zigbee®, Thread and Bluetooth® mesh networking, and EFR32BG21 is dedicated to Bluetooth Low Energy and Bluetooth mesh connectivity.
Our Wireless Gecko Series 2 portfolio leads a growing crowd of wireless MCUs and SoCs for connected devices. Halfhill compares EFR32MG21 features and performance with several competing products from other large wireless MCU/SoC vendors:
• NXP’s Kinetis K32W0x
• ST Microelectronics’ STM32WB
• Texas Instrument’s SimpleLink CC1352R
Halfhill acknowledges that our new Series 2 portfolio includes the lowest power wireless SoCs on the market while offering the tiniest footprint, boasting a 4 mm x 4 mm surface-mount QFN package with only 32 pins. The SoCs also offer the highest ambient temperature range, making them suitable for applications with extreme heat exposure such as connected LED lighting and various Industrial IoT applications. The latest Series 2 SoCs are ideal for a wide range of line-powered IoT products including gateways, hubs, lights, voice assistants and smart electric meters.
Series 1 customers can easily upgrade to the Series 2 platform. With IoT security threats increasing, Wireless Gecko Series 2 leads the pack in providing improved security features but comes at virtually no additional cost when upgrading to Series 2. The enhanced radios offer a +20 dBm option for longer range, allowing customers to choose the right power level and wireless range for each design. The Series 2 radio also offers better selectivity, which is helpful as more and more wireless devices use the crowded 2.4 GHz band.
Read the full Microprocessor Report: https://www.silabs.com/documents/public/white-papers/the-linley-group-microprocessor-report-silicon-labs-upgrades-wireless-mcus.pdf