Physical modifications to the Silicon Labs radio boards are not recommended.  Cutting away FR4 PCB material can cause open circuits on multiple layers as well as short circuits between layers.   

Regarding your request for a schematic, note that Silicon Labs considers all module designs as IP and does not provide design documentation for modules except in certain regulatory compliance test situations where the design material is provided to the test house upon request, under signed NDA, and not to the customer.   Additionally, some Wireless Starter Kit Radio Board designs are available on the Silicon Labs web site.  However, the WSTK Radio Board design files for the MGM210P may not be available yet without a signed NDA.

Contact your local Silicon Labs Sales representative for availability or a recommendation on the best option Bluetooth module to use with the EFMUB3 / Thunderboard combination.  Alternately, you can obtain a Wireless Starter Kit on-line which contains the modules you are requesting for use in your project.

Best Regards,

Hi Rahul,

The OPN 'MGM13S12F512GA-V3R' can be read as follows:

MGM13S --> Mighty Gecko Module 13 SiP

12 --> 19dBm Tx power    /    02 --> 10dBm Tx power

F512 --> Flash size 512kB

GA --> Built-in antenna    /    GN --> RF pin for external antenna

As all of the offered variants have flash size = 512kB as a common factor, for certification purposes the naming convention does not consider F512 and thus certification documents refer to part numbers as MGM13S12A.

Speaking specifically about MGM13S modules, all of the part variants mentioned in the Datasheet rev 1.1 are RED certified.

Hello Poompat,

Please review application note AN1088 for this information.

https://www.silabs.com/documents/public/application-notes/an1088-designing-with-pcb-antenna.pdf

Best regards

Hello Abhishek,

The qualification report for this module is not currently available.  Please contact your local Silicon Labs Sales representative, who can enter an internal Request for Information on your behalf for the specific information you are requesting.

Best regards,

Hello C P,

Page 11 states the following module placement guidance for optimal performance:

"

4.1 Module Placement and Application PCB Layout Guidelines

• Place the module at the edge of the PCB, as shown in Figure 4.1 Recommended Application PCB Layout for BGX13P with Integrated Antenna on page 11.

• Do not place any metal (traces, components, battery, etc.) within the clearance area of the antenna.

• Connect all ground pads directly to a solid ground plane.

• Place the ground vias as close to the ground pads as possible.

• Do not place plastic or any other dielectric material in contact with the antenna.

"

The lower left picture indicates the module is placed off-center and does not provide enough ground plane to the left of the module for proper antenna performance

Conversely, the upper right picture shows the module to not be placed at the edge of the PCB, again the antenna will have issues radiating properly.

Best regards

Take a look at this KBA. https://www.silabs.com/community/wireless/bluetooth/knowledge-base.entry.html/2019/04/18/design_and_assembly-ZeyN.  Here we state, "It is always recommended to avoid more than two reflow cycles of the parts."

Regarding the reflow profile itself, see AN1223 for further guidance: https://www.silabs.com/documents/public/application-notes/an1223-lga-manufacturing-guidance.pdf

As the profile parameters will be different based upon the specific assembly process used in building the PCA, it is not possible to provide a more specific reflow profile here and it is left to the Contract Manufacturer who is building the PCA to determine the profile based on their process and by applying the IPC standard mentioned in the datasheet.  If the contract manufacturer has any issue in doing so, they should submit a portal case into customer support and provide the customer name and the exact Silicon Labs module being assembled.

The Thunderboard was not designed for use with a battery charger / connected battery - hence the transistor switch which is meant to protect the battery and other circuitry on the Thunderboard.  Any modifications you make to bypass the on-board transistor switch are done at your own risk.

Thank you,

-Bill

Multiple layer PCB recommendations for the ground plane are described on page 68 of the datasheet in this link.  

https://www.silabs.com/documents/public/data-sheets/bgm13s-datasheet.pdf

You need to have the top layer laid out as shown.  A single ground plane placed on the top layer is enough but we recommend using the outside layers for ground plane and use inner layers for power and signal traces in order to use the outer ground plane layers as shields.  It is a good idea to also create ground pour around the perimeter of the inner signal layers and stitch all of the grounds with vias to the top layer ground pour.

Regarding certifications, see the documents at this link for more information:

https://www.silabs.com/support/resources.ct-miscellaneous?query=bgm13s

Best regards,

-Bill

Hello Juan,

Our certification expert has provided the following guidance on this topic:

"It is ok to use lower power. For the CE the end product manufacturer must have all the test evidence that is needed to show compliance. Having a new antenna means radiated emissions testing. Most likely the conducted test can still be inherited from the modules test reports. For the FCC it is normal C2PC according to KDB 996369 and KDB 178919 which you can find here: https://apps.fcc.gov/oetcf/kdb/forms/AdvancedExternalSearch.cfm"

Best regards,

-Bill

Hi David,

It appears you have submitted a portal case for this issue.  Please redirect all correspondence to the portal case going forward.

Thank you,

-Bill