The specific values to use in your design are located in section 4.1 in AN930.2. Be sure to review AN930.2 fully for the full context regarding the EFR32 RF match.
I am not sure what you mean by 'start' copper thickness and 'finished' copper thickness. At least, when I have specified fabrication notes for my PCB layout designs, I have not been aware of these options.
Copper thickness is determined by the designer. Often 1 oz. (1.4 mils, 0.035 mm) or 1/2 oz. (0.7 mils, 0.018 mm) copper are used or a combination of the two if more than two layers are in the design; 1 oz. copper on the top and bottom layers and 1/2 oz copper on the inner layers.
I am not sure what you mean by 'start' copper thickness and 'finished' copper thickness. At least, when I have specified fabrication notes for my PCB layout designs, I have not been aware of these options.
Copper thickness is determined by the designer. Often 1 oz. (1.4 mils) or 1/2 oz. (0.7 mils) copper are used or a combination of the two if more than two layers are in the design; 1 oz. copper on the top and bottom layers and 1/2 oz copper on the inner layers.
I am not sure what you mean by 'start' copper thickness and 'finished' copper thickness. At least, when I have specified fabrication notes for my PCB layout designs, I have not been aware of these options.
Copper thickness is determined by the designer. Often 1 oz. (1.4 mils) or 1/2 oz. (0.7 mils) copper are used or a combination of the two if more than two layers are in the design; 1 oz. copper on the top and bottom layers and 1/2 oz copper on the inner layers.
The 0.22mm trace width for traces between the RF matching circuit components is not in itself significant to the overall load impedance presented to the EFR32 RF port by the RF matching circuit and so the actual intent here is to reduce path losses caused by reflections from widely varying copper transitions between the component pads and the connecting traces. This is described also in section 3 of AN928.2. Basically, the traces can be whichever width the designer chooses as long as the overall load impedance presented to the EFR32 is correct. The load impedance itself is adjusted by adjusting the values of the RF matching circuit components. This is less likely to be necessary if you keep the trace widths between the components the same or close to the width shown.
For a comprehensive description of the RF matching load impedance circuit, please review AN930.2
The 0.22mm trace width for traces between the RF matching circuit components is not in itself significant to the overall load impedance presented to the EFR32 RF port by the RF matching circuit and so the actual intent here is to reduce path losses caused by reflections from widely varying copper transitions between the component pads and the connecting traces. This is described also in section 3 of AN928.2. Basically, the traces can be whichever width the designer chooses as long as the overall load impedance presented to the EFR32 is correct. The load impedance itself is adjusted by adjusting the values of the RF matching circuit components. This is less likely to be necessary if you keep the trace widths between the components the same or close to the width shown.
For a comprehensive description of the RF matching load impedance circuit, please review AN930.2
The 0.22mm trace width for traces between the RF matching circuit components is not in itself significant to the overall load impedance presented to the EFR32 RF port by the RF matching circuit and so the actual intent here is to reduce path losses caused by reflections from widely varying copper transitions between the component pads and the connecting traces. This is described also in section 3 of AN928.2. Basically, the traces can be whichever width the designer chooses as long as the overall load impedance load presented to the EFR32 is correct. The load impedance itself is adjusted by adjusting the values of the RF matching circuit components. This is less likely to be necessary if you keep the trace widths between the components the same or close to the width shown.
For a comprehensive description of the RF matching load impedance circuit, please review AN930.2
The Silicon Labs modules are designed with the decoupling capacitors built in so that you don't need to add external decoupling. However per section 7.1 in the BGM13P32 datasheet, you may want to investigate if you need to add a high value capacitor to address voltage drops on the battery when in the high power TX mode. This is due to severe voltage drops on a Lithium battery could shorten its life span.
Physical modifications to the Silicon Labs radio boards are not recommended. Cutting away FR4 PCB material can cause open circuits on multiple layers as well as short circuits between layers.
Regarding your request for a schematic, note that Silicon Labs considers all module designs as IP and does not provide design documentation for modules except in certain regulatory compliance test situations where the design material is provided to the test house upon request, under signed NDA, and not to the customer. Additionally, some Wireless Starter Kit Radio Board designs are available on the Silicon Labs web site. However, the WSTK Radio Board design files for the MGM210P may not be available yet without a signed NDA.
Contact your local Silicon Labs Sales representative for availability or a recommendation on the best option Bluetooth module to use with the EFMUB3 / Thunderboard combination. Alternately, you can obtain a Wireless Starter Kit on-line which contains the modules you are requesting for use in your project.
