Datasheet states the RH sensor cannot go through hot air rework due to possible alteration of the device’s characteristics and damage to the cover during hot air rework. Can hot air rework be used to replace a device on a pcb?
Solder joint touch up can be done with a limit of 5 seconds per lead. It is generally recommended that any other rework be done with a fresh device. The problem is hot air rework can reach temperatures much hotter than the peak temperature of the device. When the cover is heated too much it will shrink very quickly. This happens very easily when air flow is directed from the top of the device. If it is possible to use the hot air tool from the below the PCB there should be no damage to the device or the cover.