We are using SI5344 on our design and the delay is very critical for us. We will be having our proto build next month and for SI5344 we cannot get the latest REV D device on time so we plan to use Rev B instead. Rev B has an errata doc and one of the issues on rev B die is the in consistent in-out delay at high temp. Could you please give me more details about this issue?
1. At what temperature does this occur?
2. Does the zero delay feature helps limit the variation?
3. Can I have the max delay measured at this high temp?
It looks like this issue is resolved on Rev D die.