Please see the attached PDF for the answers to the following questions:
1 Packaging Questions
1.1 Are the Si570 and Si571 pin-outs, PCB land patterns, and package dimensions compatible with industry standards?
1.2 What is the material composition of the pins?
1.3 What is the MSL (Moisture Sensitivity Level) of the ceramic packages?
1.4 Are the CLCC packages hermetically sealed?
1.5 How much do the Si570 and Si571 oscillators weigh?
2 Quality & Production Questions
2.1 Where can I find RoHS, REACH or other materials related compliance information?
2.2 Are any flame retardants (Halogen compounds) used in the Si570 and Si571 packages?
2.3 Are the oscillator products available in Tape & Reel?
2.4 Where is the FIT information for the Si570 and Si571 devices?
2.5 What are the qualification test requirements for Silicon Laboratories’ lead-free, RoHS-compliant, CLCC package technology?
3 Thermal & Soldering Questions
3.1 What is the maximum operating junction temperature for the Si570 and Si571 devices?
3.2 What are ΘJA and ΘJC for the Si570 and Si571 devices?
3.3 What is the typical temperature rise of the Si570 and Si571 devices?
3.4 Are the devices compatible with both leaded and “lead-free” assembly processes?
3.5 What are the maximum reflow temperatures and profiles recommended for “lead-free” and “leaded” solder reflow processes?
4 I2C Communication Questions
4.1 What is the I2C address of my Si570 or Si571?
4.2 Is the I2C Bus working correctly?
4.3 What are some items to check or troubleshooting suggestions to consider if there are general I2C communication problems?
4.4 Are the I2C inputs on a 1.8V or 2.5V Si57x 3.3V tolerant?
4.5 When is a voltage translator needed when interfacing the Si57x?
4.6 How exactly should the Si57x device be addressed?
4.7 What are the digital threshold levels for SCL and SDA?
4.8 Are there any specific differences that make the Si57x programming interface I2C compatible as opposed to I2C conformant?
4.9 What speeds of operation can the Si57x support?
5 Programming Questions
5.1 Is the correct register bank being written based on device stability?
5.2 Why do we need to calculate fXTAL when reconfiguring the output clock for large changes in output frequency?
5.3 What is the tuning resolution of the Si57x?
5.4 What kind of memory is used in the Si57x?
5.5 Can I change the default startup frequency or the I2C address?
5.6 What happens if we attempt to program a new frequency outside the specified speed grade of the device?
5.7 What determines whether the DCO needs to be “frozen” when programming a new frequency?
5.8 How does freezing the DCO help?
5.9 Is the Unfreeze to NewFreq timeout spec being exceeded?
5.10 Why does the device reset when attempting a large frequency step without properly freezing the DCO?
5.11 What is the “anchor” frequency?
5.12 What happens to the output clock when making frequency changes?
5.13 Will the Si57x respond if every transaction is terminated by a stop before another start is sent?
5.14 Should a delay be assumed for RST_REG just as with power up?
5.15 What is a good software delay to use after a RECALL or RST_REG?
5.16 What is the difference between RECALL and RST_REG?
5.17 If one chooses to assert a RECALL, what is the general sequence of operations?
5.18 Is there a significant advantage to asserting a RECALL as opposed to a RST_REG?
6 VCXO Questions
6.1 What is Absolute Pull Range (APR)?
6.2 Why is there no Min APR listed for 2.5v or 1.8v for certain Kv values?