Thermocouple position for integrated circuits thermal test environmental conditions under still air
04/106/2019 | 08:03 AM
Placement of the thermocouple shall be 25 +/- 5 mm below the bottom plane of the printed circuit test board and 25+/- 5 mm from the side wall. Please refer to JESD51-2A for detail information.
Thermocouple position for integrated circuits thermal test environmental conditions under still air
Placement of the thermocouple shall be 25 +/- 5 mm below the bottom plane of the printed circuit test board and 25+/- 5 mm from the side wall. Please refer to JESD51-2A for detail information.