Terminal Finish for the Si534x/8x/9x family devices
06/162/2020 | 08:58 PM
Package: All devices with the QFN packages use NiPdAu plating.
Thickness: Following table gives details about the thickness of different materials:
Ni
10-20 µin
Pd
0.1-0.5 µin
Au-Ag
Flash (<<0.1 µin)
Devices: All the devices from the Si534x (Si5340/41/42/44/45/46/47/48) family, the external crystal devices from the Si539x (Si5391/92/94/95/96/97) family and the Si5381/82/86 devices have the above terminal finish.
Package: All devices with the LGA packages use the Electroplated Ni/Au plating.
Thickness: Following table gives details about the thickness of different materials:
Ni
4-20 µm
Au
0.4-1.3 µm
Devices: The integrated crystal devices from the Si539x (Si5392/94/95/95/97) and the Si5383/83/88/89 devices have the above terminal finish.
If more details are required regarding device composition, please refer our RFI portal. Following are the steps to access the same:
Terminal Finish for the Si534x/8x/9x family devices
Package: All devices with the QFN packages use NiPdAu plating.
Thickness: Following table gives details about the thickness of different materials:
Ni
10-20 µin
Pd
0.1-0.5 µin
Au-Ag
Flash (<<0.1 µin)
Devices: All the devices from the Si534x (Si5340/41/42/44/45/46/47/48) family, the external crystal devices from the Si539x (Si5391/92/94/95/96/97) family and the Si5381/82/86 devices have the above terminal finish.
Package: All devices with the LGA packages use the Electroplated Ni/Au plating.
Thickness: Following table gives details about the thickness of different materials:
Ni
4-20 µm
Au
0.4-1.3 µm
Devices: The integrated crystal devices from the Si539x (Si5392/94/95/95/97) and the Si5383/83/88/89 devices have the above terminal finish.
If more details are required regarding device composition, please refer our RFI portal. Following are the steps to access the same:
Now if the information you need is not present there, then you have to create a support request using the following link:
https://www.silabs.com/support