According to the datasheet for the EZR family, the stencil design for the center ground pad, should be a 4x4 array of 1.45mm squares on a 1.25mm pitch.
If pitch is the distance between the center of the squares, then they overlap creating one large hole.
If the pitch is between the edges of the squares, the use of the word pitch would be misleading and the 4x4 array would exceed the ground pad and overlap the pins.
And a suggestion, in addition to fixing the stencil text, provide a stencil diagram as done in the EFM and Si family of IC's, to avoid any misunderstandings.
This is a mistake in the datasheet. The pitch is the distance between the center point of the squares, and the right value of the pitch is 1.8mm. The size of the square is correct (1.45mm).
Thank you for your notification, the datasheet will be updated soon.