How should I route the traces on more-layer RF designs for optimal performance?
In order to achieve the possible best RF radiated performance the followings are suggested for more-layer RF board designs:
- Top Layer: Components and short traces. Top layer should use as large and continuous GND plane metallization as possible (with many stitching GND vias) on the entire PCB.
- 1st inner layer: GND plane and traces if necessary. The most important rule is to keep the GND pour metallization unbroken beneath the RF areas (between the antenna, matching network and RF chip). Traces can be routed under the non-RF areas and use GND pour where possible.
- 2nd, 3rd... inner layers: Traces. VDD and all other traces are suggested to be routed on these layers. Use GND pour where possible.
- Bottom Layer: GND plane. Use as large and continuous GND plane as possible. Do not route traces on this layer, just if it is necessary, e.g. short connection traces to connectors.
- Generic for each layer: Try to avoid routing traces along or close to the board edges. It is recommended to place ground stitching vias with GND pour along the PCB edges.