DATE:	3/20/2013

REF: 	Si7013USB-DONGLE REV 1.0

TECHNOLOGY:
	4-LAYER
	MINIMUM TRACE/SPACE: 6/5 (mils)
	MINIMUM SMD PITCH: 0.5mm
	SMD PAD COUNT:
		PRI: 116
		SEC: 0

TEST REQUIREMENTS: IPC-D-356 NETLIST (PROVIDED)

CONTACT:
	Chuck Tidwell
	VOICE:(512)428-1683
	CELL:(512)797-8024
	FAX:(512)464-9425
	chuck.tidwell@silabs.com

SHIPPING DESTINATION: (UNLESS OTHERWISE NOTED)
	FedEx Standard Overnight
	Act# 217859387
	
ATTN:	Wireline Eng. Svc.
	Silicon Laboratories
	400 W. Cesar Chavez St.
	Austin, TX  78701

GERBER FILE FORMAT:
	RS-274-X
	2.5
	ENGLISH
	ABSOLUTE
	TRAILING ZEROS SUPPRESSED

FILES PROVIDED:
	DESCRIPTION                     FILENAME
	--------------------	        ---------------
	ASSEMBLY PRIMARY                7013USBD_PASM.pho
	SILKSCREEN PRIMARY              7013USBD_PSS.pho
	SOLDER MASK PRIMARY             7013USBD_PSM.PHO
	PRIMARY LAYER                   7013USBD_PRI.PHO
	SECONDARY LAYER                 7013USBD_SEC.PHO
	SOLDER MASK SECONDARY           7013USBD_SSM.PHO
	SILKSCREEN SECONDARY            7013USBD_SSS.PHO
	PASTE MASK PRIMARY              7013USBD_PSP.PHO
	BOARD OUTLINE                   7013USBD_BRD.PHO
	FAB DRAWING                     7013USBD_FAB.PHO
	APERTURE FILE                   7013USBD_APR.REP
	NC DRILL FILE                   7013USBD_NC.DRL
	NC DRILL TOOLS                  7013USBD_NC.REP
	IPC-D-356 NETLIST               7013USBD_NET.IPC

VENDOR MARKINGS:
	*** NO ADDED ETCH ALLOWED ***
	SILKSCREEN ONLY

