Common Specs
- Pin-compatible, drop-in upgrades for popular high-speed digital optocouplers
- Performance and reliability advantages vs. optocouplers
- Resistant to temperature, age, and forward current effects
- 10x lower FIT rate for longer service life
- Higher common-mode transient immunity: >50 kV/μs typical
- Lower power and forward input diode current
- PCB footprint compatible with optocoupler packaging
- Wide range of product options
- Diode emulator input
- 3 to 30 V open collector output
- Propagation delay 30 ns typical
- Data rates from dc to 15 Mbps
- 3.75 and 5 kV reinforced isolation
- UL, CSA, and VDE certifications
- Wide operating temperature range –40 to +125 °C
- RoHS-compliant packages
Find the Right Si87xx Device
Select Columns
| Part Number | Isolation Rating (kVrms) | 10 kV Surge | Enable Control | Package Type | Max Data Rate (Mbps) | Default Output State | Integrated Pull-Up | AEC-Q100 |
|---|---|---|---|---|---|---|---|---|
| 3.75 | GW DIP8 | 15 | Hi-Z | |||||
| 3.75 | NB SOIC8 | 15 | Hi-Z | |||||
| 5 | WB SOIC6 | 15 | Hi-Z | |||||
| 3.75 | GW DIP8 | 15 | Hi-Z | |||||
| 3.75 | NB SOIC8 | 15 | Hi-Z | |||||
| 5 | WB SOIC6 | 15 | Hi-Z | |||||
| 3.75 | GW DIP8 | 1 | Hi-Z | |||||
| 3.75 | NB SOIC8 | 1 | Hi-Z | |||||
| 5 | WB SOIC6 | 1 | Hi-Z | |||||
| 3.75 | GW DIP8 | 15 | Hi-Z | |||||
| 3.75 | NB SOIC8 | 15 | Hi-Z | |||||
| 3.75 | GW DIP8 | 15 | Hi-Z | |||||
| 3.75 | NB SOIC8 | 15 | Hi-Z | |||||
| 3.75 | GW DIP8 | 1 | Hi-Z | |||||
| 3.75 | NB SOIC8 | 1 | Hi-Z | |||||
| 3.75 | GW DIP8 | 15 | Hi-Z | |||||
| 3.75 | NB SOIC8 | 15 | Hi-Z | |||||
| 3.75 | GW DIP8 | 15 | Hi-Z | |||||
| 3.75 | NB SOIC8 | 15 | Hi-Z | |||||
| 3.75 | GW DIP8 | 1 | Hi-Z | |||||
| 3.75 | NB SOIC8 | 1 | Hi-Z | |||||
| 5 | WB SOIC6 | 15 | Hi-Z | |||||
| 3.75 | GW DIP8 | 15 | Hi-Z | |||||
| 3.75 | NB SOIC8 | 15 | Hi-Z | |||||
| 3.75 | GW DIP8 | 15 | High | |||||
| 3.75 | NB SOIC8 | 15 | High | |||||
| 3.75 | GW DIP8 | 15 | Hi-Z | |||||
| 3.75 | NB SOIC8 | 15 | Hi-Z | |||||
| 3.75 | GW DIP8 | 15 | Hi-Z | |||||
| 3.75 | NB SOIC8 | 15 | Hi-Z | |||||
| 5 | WB SOIC6 | 15 | Hi-Z | |||||
| 3.75 | GW DIP8 | 15 | Hi-Z | |||||
| 3.75 | NB SOIC8 | 15 | Hi-Z | |||||
| 3.75 | GW DIP8 | 15 | Low | |||||
| 3.75 | NB SOIC8 | 15 | Low | |||||
| 3.75 | NB SOIC8 | 15 | Hi-Z | |||||
| 3.75 | NB SOIC8 | 15 | High |
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Isolated USB Evaluation Kit
The Isolated USB Evaluation Kit is a demonstration and evaluation platform for creating Isolated USB solutions. It can be used in conjunction with EFM32 and EFM8 MCU Stater Kits (STKs). It simplifies the process of creating an isolated USB solution by offering an already built and functioning platform. The board schematics are available and there are examples that can be run on the MCU STKs to communicate via isolated USB. The board contains two isolators, a USB to UART bridge device, a 20-pin breakout header for easy connection, many headers for debugging and evaluation, and a micro USB port.
Isolated USB Evaluation Kit
The Isolated USB Evaluation Kit is a demonstration and evaluation platform for creating Isolated USB solutions. It can be used in conjunction with EFM32 and EFM8 MCU Stater Kits (STKs). It simplifies the process of creating an isolated USB solution by offering an already built and functioning platform. The board schematics are available and there are examples that can be run on the MCU STKs to communicate via isolated USB. The board contains two isolators, a USB to UART bridge device, a 20-pin breakout header for easy connection, many headers for debugging and evaluation, and a micro USB port.