Please see the attached PDF for the answers to the following questions: 

1      Are the Si515 and Si516 pin-outs, PCB land patterns, and package dimensions compatible with industry standards?

2      What is the material composition of the pins?

3      What is the MSL (Moisture Sensitivity Level) of the ceramic packages?

4      What is the MSL (Moisture Sensitivity Level) of the 2.5x3.2mm package?

5      Are the CLCC packages hermetically sealed?

6      What about RoHS, REACH or other materials related compliance information?

7      Are any flame retardants (Halogen compounds) used in the Si515 or Si516 packages?

8      How much do the Si515 and Si516 oscillators weigh?

9      Are the oscillator products available in Tape & Reel?

10   What is the maximum operating junction temperature for the Si515 and Si516 devices?

11   What are ΘJA and ΘJC for the Si515 and the Si516?

12   What is the Coefficient of Thermal Expansion (CTE) in the plane of the PWB (x and y) for the 2.5x3.2mm package?

13   What is the typical temperature rise of the Si515 and Si516?

14   Are the devices compatible with both leaded and “lead-free” assembly processes?

15   What are the maximum reflow temperatures and profiles recommended for “lead-free” and “leaded” solder reflow processes?

16   Where is the FIT information for the Si515 and Si516?

17   What are the qualification test requirements for Silicon Laboratories’ lead-free, RoHS-compliant, CLCC package technology?

18   Is the FS pin on a Si515 or Si516 internally pulled up or pulled down?

19   What is Absolute Pull Range (APR)?

20   Why is there no Min APR listed for 2.5v or 1.8v for certain Kv values?

Please see the attached PDF for the answers to the following questions: 

1      Are the Si510, Si511, Si512, or Si513 pin-outs, PCB land patterns, and package dimensions compatible with industry standards?

2      What is the material composition of the pins?

3      What is the MSL (Moisture Sensitivity Level) of the ceramic packages?

4      What is the MSL (Moisture Sensitivity Level) of the 2.5x3.2mm package?

5      Are the CLCC packages hermetically sealed?

6      What about RoHS, REACH or other materials related compliance information?

7      Are any flame retardants (Halogen compounds) used in the Si510, Si511, Si512, and Si513 package?

8      How much do the Si510, Si511, Si512, and Si513 oscillators weigh?

9      Are the oscillator products available in Tape & Reel?

10   What is the maximum operating junction temperature for the Si510, Si511, Si512, and Si513?

11   What are ΘJA and ΘJC for the Si510, Si511, Si512, and Si513?

12   What is the Coefficient of Thermal Expansion (CTE) in the plane of the PWB (x and y) for the 2.5x3.2mm package?

13   What is the typical temperature rise of the Si510, Si511, Si512, or Si513?

14   Are the devices compatible with both leaded and “lead-free” assembly processes?

15   What are the maximum reflow temperatures and profiles recommended for “lead-free” and “leaded” solder reflow processes?

16   Where is the FIT information for the Si510, Si511, Si512, and Si513?

17   What are the qualification test requirements for Silicon Laboratories’ lead-free, RoHS-compliant, CLCC package technology?

18   Is the FS pin on a Si510, Si511, Si512, or Si513 internally pulled up or pulled down?

Please see the attached PDF for the answers to the following questions:

1      Is the Si514 pin-out, PCB land pattern, and package dimensions compatible with industry standards?

2      What is the material composition of the pins?

3      What is the MSL (Moisture Sensitivity Level) of the ceramic packages?

4      What is the MSL (Moisture Sensitivity Level) of the 2.5x3.2mm package?

5      Are the CLCC packages hermetically sealed?

6      What about RoHS, REACH or other materials related compliance information?

7      Are any flame retardants (Halogen compounds) used in the Si514 package?

8      How much does the Si514 oscillators weigh?

9      Are the oscillator products available in Tape & Reel?

10   What is the maximum operating junction temperature for the Si514?

11   What is the ΘJA and ΘJC for the Si514?

12   What is the Coefficient of Thermal Expansion (CTE) in the plane of the PWB (x and y) for the 2.5x3.2mm package?

13   What is the typical temperature rise of the Si514?

14   Are the devices compatible with both leaded and “lead-free” assembly processes?

15   What are the maximum reflow temperatures and profiles recommended for “lead-free” and “leaded” solder reflow processes?

16   Where is the FIT information for the Si514?

17   What are the qualification test requirements for Silicon Laboratories’ lead-free, RoHS-compliant, CLCC package technology?

18   What is the I2C address of my Si514?

19   Is the I2C Bus working correctly?

Please see the attached PDF for the answers to some of the most common Si595, Si596, and Si597 questions. 

Please see the attached PDF for the answers to some of the most common Si598 and Si599 questions.

Please see the attached PDF for the answers to some of the most common Si55x Questions. 

Please see the attached PDF for the answers to some of the most common Si53x questions.

Please see the attached PDF for the answers to some of the most common Si569 questions. 

Please see the attached PDF for the answers to some of the most common Si561 questions. 

Please see the attached PDF for the answers to some of the most common Si567 questions.