BGM13S EFR32BG13 Series 1 Bluetooth® Module - SiP

Ultra-Small System-In-Package for Bluetooth 5 LE, Bluetooth 5.1 Angle of Arrival (AoA), and Bluetooth Mesh Connectivity

The BGM13S is a SIP module for Bluetooth 5 LE and Bluetooth mesh connectivity built around the EFR32BG13 Series 1 SoC. It delivers robust RF performance, low energy consumption, regulatory compliance certifications, a wide selection of MCU peripherals, and a simplified development experience, all in a small 6.5 mm x 6.5 mm package.

Minimizing the engineering efforts and development costs associated with adding Bluetooth connectivity to any design, the BGM13S helps accelerate the time-to-market of products for end applications like wearables, IoT end-node devices and gateways, sports and wellness, home and building automation, beacons, industrial automation, and others.

Module Benefits

  • Adds Bluetooth 5 LE or Bluetooth mesh connectivity to any design easily and fast
  • Supports high throughput, long range, and regular Bluetooth LE PHYs
  • Delivers sub-1-meter location accuracy with Bluetooth 5.1 angle of arrival (AoA) 
  • Requires a total PCB area of 51 mm2 only, including antenna clearance
  • Eliminates need for RF design expertise
  • Contains all necessary external components, including antenna
  • Comes with regulatory RF compliance certifications
  • Works with industry-proven, certified stacks and development tools from Silicon Labs
  • Supports stand-alone and network co-processor (NCP) operation
  • Provides easy migration path to discrete Blue Gecko SoC if applicable
  • Enables rapid time-to-market
  • Achieves 400m range at +8 dBm TX and 700 m at +18 dBm TX (Open field, LOS)

Module Specifications

Supported Protocols:

  • Bluetooth 5.0 LE
  • Bluetooth 5.1 AoA
  • Bluetooth mesh

Regulatory Certifications:

  • FCC
  • CE
  • IC / ISEDC
  • MIC / Telec
  • Others

Operating Range & Size:

  • 1.8 V to 3.8 V, single supply
  • -40 °C to +85 °C
  • 6.5 mm × 6.5 mm × 1.4 mm

Wireless SoC :

  • 2.4 GHz Radio
  • Up to +18 dBm TX power
  • 38.4 MHz ARM Cortex -M4
  • 512 kB Flash
  • 64 kB RAM
  • Integrated DC-DC converter

Current Consumption :

  • RX: 9.7 mA
  • TX (0 dBm): 8.9 mA
  • EM2 (Deep Sleep): 1.4 μA
  • EM3 (Stop): 1.14 μA

Security:

  • AES256/128 Hardware Crypto Accelerator with ECC, SHA-1, SHA-2
  • TRNG

MCU Peripherals:

  • Up to 32 GPIO
  • 12-bit ADC
  • Voltage DACs
  • Operational Amplifiers
  • Low-Energy Sensor Interface
  • Multi-channel Capacitive Sense interface
  • 2 x Analog Comparator
  • Low Energy UART
  • 4 x USART (UART, SPI, IrDA, I2S)
  • 2 x I²C
  • Timers


BGM13S Modules

Part Number Buy  Data Sheet Radio Board Antenna Package BLE Bluetooth 5 Bluetooth 5.1 Dimensions (mm) TX Power GPIO MCU Core RAM (kB) Flash (kB)
BGM13S32F512GA-V2 cart icon PDF icon SLWRB4305A Built-in Cut Tape Yes Advertising AoA, GATT caching 6.5 x 6.5 x 1.4 +18 dBm TX 32 ARM Cortex-M4 64 512
BGM13S32F512GA-V2R cart icon PDF icon SLWRB4305A Built-in Reel Yes
Advertising
AoA, GATT caching 6.5 x 6.5 x 1.4
+18 dBm TX
32 ARM Cortex-M4
64 512
BGM13S32F512GN-V2 cart icon PDF icon SLWRB4305A RF Pin
Cut Tape Yes
Advertising
AoA, GATT caching 6.5 x 6.5 x 1.4
+18 dBm TX
32
ARM Cortex-M4
64 512
BGM13S32F512GN-V2R cart icon PDF icon SLWRB4305A RF Pin Reel Yes
Advertising
AoA, GATT caching 6.5 x 6.5 x 1.4
+18 dBm TX 32 ARM Cortex-M4
64 512
BGM13S22F512GA-V2 cart icon PDF icon SLWRB4305C Built-in Cut Tape Yes Advertising AoA, GATT caching 6.5 x 6.5 x 1.4 +8 dBm TX 32 ARM Cortex-M4 64 512
BGM13S22F512GA-V2R cart icon PDF icon SLWRB4305C Built-in Reel Yes Advertising AoA, GATT caching 6.5 x 6.5 x 1.4 +8 dBm TX 32 ARM Cortex-M4 64 512
BGM13S22F512GN-V2 cart icon PDF icon SLWRB4305C RF Pin Cut Tape Yes Advertising AoA, GATT caching 6.5 x 6.5 x 1.4 +8 dBm TX 32 ARM Cortex-M4 64 512
BGM13S22F512GN-V2R cart icon PDF icon SLWRB4305C RF Pin Reel Yes Advertising AoA, GATT caching 6.5 x 6.5 x 1.4 +8 dBm TX 32 ARM Cortex-M4 64 512

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