Miniaturizing IoT Designs

Tom Nordman, Pasi Rahikkala (August 2020)

This paper explores the challenges that come with designing connected devices into increasingly smaller products, specifically antenna integration and how system-in-package (SiP), for example, BGM220S or BGM13S modules can help.

The Size Challenge

As we wirelessly connect more and more devices to the Internet, electronics engineers face several challenges, including how to package a radio transmitter into their existing device real estate and how to make increasingly smaller devices. They’re also striving to meet consumer demand for Internet of Things (IoT) products that are ergonomically easy to use and unobtrusive.

Size expectation is one of the most frequently asked questions when considering IoT devices, along with radio performance and price.

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