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BGM121A256

The World’s Smallest Bluetooth SiP Module

Silicon Labs’ BGM121A256 SiP Bluetooth Module has +8 dBm TX power and is targeted for applications where ultra-small size, reliable high-performance RF, low-power consumption and easy application development are key requirements. At 6.5 x 6.5 x 1.4 mm, the BGM121A256 module fits applications where size is a constraint. BGM121A256 also integrates a high performance, ultra-robust antenna, which requires minimal PCB, plastic and metal clearance. The total PCB area required by BGM121A256 is only 51 mm². The device also integrates a Bluetooth 4.2 compliant Bluetooth stack and it can also run end-user applications on-board or alternatively used as a network co-processor over one of the host interfaces.
 

Key Specs

 
Antenna
Built-in
Package
SiP
BLE
Yes
Bluetooth 5
No
Range (m)
up to 200
Dimensions (mm)
6.5 x 6.5 x 1.4
TX Power
8
RX Sensitivity
-90
MCU Core
ARM Cortex-M4
RAM (kB)
32
Flash (kB)
256
Antenna
Built-in
Package
SiP
BLE
Yes
Bluetooth 5
No
Range (m)
up to 200
Dimensions (mm)
6.5 x 6.5 x 1.4
TX Power
8
RX Sensitivity
-90
MCU Core
ARM Cortex-M4
RAM (kB)
32
Flash (kB)
256
EFR32BG1 Module Block Diagram

Quality Assurance, Environmental and Packaging Information

Silicon Labs targets a minimum of a 10-year lifecycle for all of its standard products and expects to produce the BGM121A256 until at least December 2027.

The longevity date shown above is for the preferred revision of this part number, for a complete list of part number revisions, use the search button below.

As part of its ongoing commitment to supply continuity, Silicon Labs may provide pin-compatible and functionally equivalent replacement products if Silicon Labs determines, at its discretion, that supply chain adjustments, product improvements, market conditions, or similar business or technical issues make this necessary or advisable.

If for business, technical or other reasons beyond Silicon Labs’ reasonable control, Silicon Labs finds that it is necessary to discontinue a product, our policy is to issue an EOL notice that provides 6 months from notice to place final orders and 12 months from notice for final shipments. This policy complies with the JEDEC standard EIA/JESD48 that is commonly used in the semiconductor industry. We provide the required support for a product for its full life cycle.

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