Device/Module image

FGM230SA27HGN

FGM230 Sub-GHz SiP Modules

FGM230S Series 2 wireless Module, FGM230SA27HGN, includes a 39 MHz ARM Cortex-M33 core, providing plenty of processing capability, while integrated security subsystem provides leading security features that greatly reduce the risk of IoT security breaches and compromised intellectual property. The device includes Secure Vault Mid, 512 kB Flash, 64 kB of RAM and is available in an ultra-compact 6.5 x 6.5 SiP module package. With up to 14 dBm maximum output power and an excellent sensitivity of 109.8 dBm, the FGM230SA27HGN provides a robust RF link for Sub-GHz applications. FGM230SA27HGN uses Simplicity Studio 5 development tools, provides easy migration and fast time to market with development kits, SDKs, mobile apps, and our patented network analyser.

 

Key Specs

 
MCU Core
ARM Cortex-M33
Core Frequency (MHz)
39
Flash (kB)
512
RAM (kB)
64
Sub-GHz Capable
Yes
Package Type
SiP
Dig I/O Pins
34
Secure Vault
Mid
MCU Core
ARM Cortex-M33
Core Frequency (MHz)
39
Flash (kB)
512
RAM (kB)
64
Sub-GHz Capable
Yes
Package Type
SiP
Dig I/O Pins
34
Secure Vault
Mid

Quality Assurance, Environmental and Packaging Information

Silicon Labs targets a minimum of a 10-year lifecycle for all of its standard products and expects to produce the FGM230SA27HGN until at least December 2035.

The longevity date shown above is for the preferred revision of this part number, for a complete list of part number revisions, use the search button below.

As part of its ongoing commitment to supply continuity, Silicon Labs may provide pin-compatible and functionally equivalent replacement products if Silicon Labs determines, at its discretion, that supply chain adjustments, product improvements, market conditions, or similar business or technical issues make this necessary or advisable.

If for business, technical or other reasons beyond Silicon Labs’ reasonable control, Silicon Labs finds that it is necessary to discontinue a product, our policy is to issue an EOL notice that provides 6 months from notice to place final orders and 12 months from notice for final shipments. This policy complies with the JEDEC standard EIA/JESD48 that is commonly used in the semiconductor industry. We provide the required support for a product for its full life cycle.

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