EFR32BG2B Series 2 Lowest Power Bluetooth® 6 SoC

Coming Soon

The EFR32BG2B SoC family is the lowest-power Bluetooth SoC in the Silicon Labs portfolio, purpose-built for the next generation of battery-powered IoT devices. Combining an 80 MHz Arm Cortex-M33, Bluetooth 6, up to 1 MB Flash, 128 kB RAM, next-generation Bluetooth Channel Sounding, hardware-based security, and rich peripheral integration, BG2B enables customers to build secure, connected products with longer battery life and lower system complexity.

Built on a new dual-output buck DC-DC architecture, BG2B delivers the lowest power across the Silicon Labs Bluetooth portfolio while integrating features that traditionally require external components. BG2B combines CAN-FD, LED boost and 4-channel LED sink, dual 12-bit ADCs, and Variable Resistive Load (VRL) into a single SoC, reducing BOM cost, PCB area, software complexity, and development effort for applications ranging from electronic shelf labels (ESLs) and asset tracking to industrial monitoring, fleet management, and vehicle diagnostics.

For location-aware applications, BG2B provides a complete Bluetooth Channel Sounding solution, supporting Mode 3, NADM, and Inline PCT, and is designed to help developers build interoperable products across leading mobile ecosystems.

EFR32BG2B Series 2 SoCs Block Diagram
Supports Bluetooth 6 & Proprietary
Lowest-power Bluetooth LE with Channel Sounding

EFR32BG2B Common Specs

Low-Power Wireless System-on-Chip

  • High-performance 32-bit 80 MHz ARM Cortex®-M33 with DSP instruction and floating-point unit for efficient signal processing
  • Up to 1016 kB Flash program memory
  • Up to 128 kB RAM data memory
  • 2.4 GHz radio operation

Radio Performance

  • -102.1 dBm sensitivity @ 250 kbps O-QPSK DSSS
  • -106.8 dBm sensitivity @ 125 kbps GFSK
  • -99.0 dBm sensitivity @ 1 Mbps GFSK
  • -96.1 dBm sensitivity @ 2 Mbps GFSK
  • TX power up to +8 dBm

Low System Energy Consumption

  • 3.1 mA RX current (1 Mbps GFSK)
  • 4.1 mA TX current @ 0 dBm output power
  • 11.06 mA TX current @ +8 dBm output power
  • 23 μA/MHz in Active Mode (EM0) at 80 MHz
  • 1.5 μA EM2 DeepSleep current (128 kB RAM retention and RTC running from LFXO)
  • 1.1 μA EM2 DeepSleep current (16 kB RAM retention and RTC running from LFXO)
  • 0.17 μA EM4 current

Wide Selection of MCU Peripherals

  • 2 x 12-bit Analog-to-Digital Converter (ADC)
    • 12-bit @ 1 Msps
  • Analog Comparator (ACMP)
  • Up to 32 General Purpose I/O pins with output state retention and asynchronous interrupts
  • 8 Channel DMA Controller
  • 20 Channel Peripheral Reflex System (PRS)
  • 3 × 16-bit Timer/Counter with 3 Compare/Capture/PWM channels
  • 2 × 32-bit Timer/Counter with 3 Compare/Capture/PWM channels
  • 32-bit Real Time Counter
  • 24-bit Low-Energy Timer for waveform generation
  • 1 × Watchdog Timer
  • 2 × Universal Synchronous/Asynchronous Receiver/Transmitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I2S)
  • 1 × Enhanced Universal Synchronous/Asynchronous Receiver/Transmitter (EUSART/SPI)
  • 2 × I2C interface with SMBus support
  • 1 x Digital microphone interface (PDM)
  • 1 x Controller Area Network with Flexible Data-Rate (CAN FD)
  • Precision Low-Frequency RC Oscillator to replace 32 kHz sleep crystal
  • RFSENSE with selective OOK mode
  • Die temperature sensor with typical +/- 1.5 °C accuracy after single-point calibration
  • 2 x Variable Resistive Load (VRL), switchable load on VREGVDD for measuring battery internal resistance and estimating remaining battery capacity
  • 4 x adjustable constant-current LED sinks with built-in blink pattern generator and PWM brightness control 

Supported Modulation Format

  • OQPSK DSSS
  • 2 (G)FSK with fully configurable shaping
  • (G)MSK

Protocol Support

Wide Operation Range

  • 1.8 to 3.8 V supply range
  • -40 to +125 °C

Packages

  • QFN40 5 mm × 5 mm × 0.85 mm, 0.4 mm pitch
  • QFN48 6 mm x 6 mm x 0.85 mm, 0.4 mm pitch

 

Secure Vault™ High

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