xGM270S Wireless Modules: Compact SiP Solutions That Accelerate Time to Market
The fastest-growing products today are battery-powered, compact, and cost-sensitive, but building them is increasingly complex. Developers are under pressure to move quickly, minimize design risk, and deliver differentiated user experiences, all while working within tight power and size constraints.
This is driving strong adoption of pre-integrated, certified 2.4 GHz wireless modules as a way to reduce development cost, simplify system design, and accelerate time to market. A well-designed module eliminates the need to manage RF layout, component selection, and lengthy certification cycles, allowing teams to focus on real benefits: battery life, application features, sensor performance, and overall product differentiation.
Introducing xGM270S Wireless SiP Modules
Silicon Labs’ xGM270S wireless module family is purpose-built for this reality. These ultra-compact system-in-package (SiP) modules combine a high-performance wireless SoC, large on-chip memory, integrated RF components, and global regulatory certifications into an exceptionally small footprint. Compared to traditional PCB-based modules, xGM270S enables smaller end products, faster development cycles, and lower overall system cost, all without compromising performance or flexibility.
BGM270S: Enabling More Bluetooth LE Applications in a Compact SiP Module
The BGM270S targets a broad set of Bluetooth (LE) end-node applications, including smart home devices, asset tracking and fleet monitoring, access control, industrial automation, sport and wellness products. With a compact 6.5 × 6.5 mm LGA SiP footprint, it’s well suited for space-constrained designs where fast integration and predictable development cycles are critical.
In industrial environments, the BGM270S Bluetooth LE module works well as a controller for sensors such as temperature, pressure, and water flow. For asset tracking tags, it enables reliable connectivity with long battery life, and for portable medical devices, including oximeters and other handheld diagnostic tools, it provides a practical path to connected health monitoring and data collection. In designs with sufficient PCB area to benefit from a fully integrated module, BGM270S SiP module simplifies RF design, reduces development risk, and accelerates time to market.
MGM270S: Speeds Time to Market for Zigbee Green Power Devices
Long battery life is important for IoT end devices, but at scale—such as commercial buildings with thousands of deployed sensors—battery replacement becomes a significant operational cost. This is where the MGM270S stands out with support for Zigbee Green Power and battery-less operation.
With 768 kB of Flash and 64 kB of RAM, the MGM270S Zigbee module provides the memory footprint needed to support Zigbee Green Power while optimizing overall system cost. Its low RX and TX current enables operation from a wider range of ambient energy sources, and the compact SiP form factor makes it ideal for space-constrained devices such as sensors and switches. Combined with global regulatory certifications, MGM270S reduces both development effort and time to market for Zigbee Green Power designs.
xGM270S Wireless SiP Modules: Differentiation That Accelerates Time to Market
Across competing 2.4 GHz module offerings in this class, customers often see similar connectivity features. Where xGM270S stands out is in its combination of an ultra-compact SiP footprint, support for both Bluetooth LE and Zigbee Green Power, and the practical advantage of global certifications and production-ready software. Together, these features reduce development risk and shorten the path from prototype to production.
For customers building smart home devices, patient health monitors, or Zigbee Green Power solutions, the xGM270S value proposition is simple: enable secure, reliable wireless connectivity while keeping system costs low and accelerating time to market—without spending months becoming wireless experts.
Explore the xGM270S wireless SiP module family (BGM270S and MGM270S) to see how quickly you can bring your next connected product to life.
