MGM210L Lighting Module for Zigbee and Thread

Optimal Performance, Security and Reliability for Smart LED Lighting

The MGM210L is a PCB module for Zigbee, Thread, Bluetooth, and multiprotocol (Zigbee + Bluetooth) connectivity built around the EFR32MG21 Wireless Gecko Series 2 SoC.  It is designed and optimized for the unique needs of smart LED lightbulbs.

The module delivers unparalleled RF performance and energy consumption compliance with CA Title 20. It also offers a powerful and energy-efficient MCU core, 1 MB of flash memory to enable future-proofing capabilities and OTA firmware updates, and a dedicated core for enhanced security features. In addition, its extended temperature rating and form factor make it suitable for enclosed operation in lightbulb housings.

Certified worldwide and supported by robust, industry-proven software and advanced development tools, MGM210L modules are a complete solution to quickly add mesh and Bluetooth networking capabilities to any IoT design.

Also available is the BGM210L Bluetooth lighting module.

Module Benefits

  •  Ideal for smart LED lighting 
  • Adds Zigbee, Thread, Bluetooth 5.1, Bluetooth Mesh or multiprotocol (Zigbee + Bluetooth 5.1) connectivity and networking capabilities easily
  • Works with industry-proven, certified stacks and development tools from Silicon Labs
  • Eliminates the need for RF design expertise
    • Contains all necessary external components, including antenna
    • Comes with worldwide RF regulatory compliance certifications
  • Enables rapid time-to-market
  • Provides easy migration path to discrete EFR32MG21 Wireless Gecko SoC if applicable
  • Supports stand-alone and network co-processor (NCP) operation

Module Specifications

Supported Protocols:

  • Zigbee
  • Thread
  • Bluetooth 5.1
  • Bluetooth Mesh
  • Multiprotocol (Zigbee + Bluetooth 5.1)

Regulatory Certifications:

  • FCC
  • CE
  • ISED
  • Others

Operating Range & Size:

  • 1.8 V to 3.8 V, single supply
  • Temperature Ranges:
    • -40 °C to +105 °C (select devices)
    • -40 °C to +125 °C (selct devices)
  • 15.5 mm × 22.5 mm × 2.2 mm

Wireless SoC:

  • 2.4 GHz Radio
  • Up to +12.5 dBm TX power
  • ARM Cortex -M33 MCU Core
  • 1024 kB Flash
  • 96 kB RAM

Current Consumption:

  • RX: 9.3 mA
  • TX (0 dBm): 16.1 mA
  • TX (12.5 dBm): 70 mA
  • EM2 (Deep Sleep): 5.1 μA

Security:

  • Secure Boot with Root of Trust and Secure Loader (RTSL)
  • Hardware Crypto Acceleration with DPA countermeasures
  • True Random Number Generator (TRNG)
  • ARM TrustZone
  • Secure Debug Interface lock/unlock

MCU Peripherals:

  • Up to 12 GPIO
  • 12-bit 1 Msps SAR ADC
  • 2 x Analog Comparator
  • Low Energy UART
  • 3 x USART (UART, SPI, IrDA, I2S)
  • 2 x I²C
  • Timers/Counters
  • 8-channel DMA Controller
  • 12-channel PRS

Getting Started with the MGM210L Series 2 Multiprotocol Module

xGM210L Development Tools

The easiest way to begin development with the MGM210L Series 2 Multiprotocol Module is with the xGM210P Module Starter Kit and the xGM201L Radio Board.

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