SiWx917 Wi-Fi® 6 plus Bluetooth® Low Energy (LE) 5.4 SoCs

Our SiWx917 SoC is our lowest power Wi-Fi 6 SoC, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWx917 SoC includes an ultra-low power Wi-Fi 6 and Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 7x7 mm QFN package. The wireless subsystem consists of a Network Wireless Processor running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4F running up to 180 MHz, embedded SRAM, FLASH, and Sensor Hub. The ARM® Cortex®-M4F is dedicated for peripheral and application-related processing, while the network wireless processor runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications.

Target applications include Smart Homes, Consumer Health and Wearables, Medical, Industrial, Retail, Smart Building and Cities, Asset Tracking.

SiWx917 Wi-Fi 6 Block Diagram
Wi-Fi 6 and Bluetooth LE 5.4, Matter ready, ultra-low power, secure wireless radio
Integrated MCU, ARM® Cortex®-M4 processor with FPU

SiWx917 Common Specs

Ultra-Low Power Wireless System on a Chip

  • Wi-Fi 6 Single band 2.4 GHz and Bluetooth Low Energy 5.4 wireless radio
  • ARM® Cortex®-M4F Application MCU up to 180 MHz
  • Integrated baseband processor, RF transceiver, high-power amplifier, balun and T/R switch
  • Embedded SRAM up to 672 KB
  • In-package Flash up to 8 MB and supports optional external Flash up to 16 MB
  • In-package PSRAM up to 8 MB and supports optional external PSRAM up to 16 MB
  • Integrated Wi-Fi stack, TCP/IP stack, Bluetooth stack supporting wireless coexistence and Matter

Wi-Fi 6

  • IEEE 802.11 b/g/n/ax  2.4 GHz 1x1 20 MHz
  • Supports 802.11ax features such as OFDMA, MU-MIMO, and Target Wake Time (TWT)
  • Transmit power up to +19.5 dBm with integrated PA
  • Receive sensitivity as low as -97.5 dBm
  • Data Rates: up to 86 Mbps (MCS7 802.11ax)
  • Operating frequency range: 2412 MHz - 2484 MHz

Bluetooth Low Energy 5.4

  • Transmit power up to +19 dBm with integrated PA
  • Receive sensitivity: LE: -96 dBm, LR 125 Kbps: -107 dBm
  • Operating frequency range: 2402 MHz - 2480 MHz
  • Bluetooth Low Energy 1 Mbps, 2 Mbps and Long-Range modes (125 kbps, 500 kbps)

Microcontroller Subsystem

  • ARM® Cortex®-M4 with FPU up to 180 MHz
  • Integrated FPU, MPU, and NVIC
  • In-System Programming (ISP) and Over-the-Air (OTA) wireless firmware update
  • Power-On Reset (POR), Brown/Black-out and Black-out Detection
  • Rich set of Analog and Digital Peripherals
  • Digital Peripherals - SDIO, 1x USART, 2x UART, 4x SPI, 3x I2C, 2x I2S, PWM, QEI
  • Timers: 4x 16/32-bit, 1x 24-bit, WDT, RTC
  • Up to 45 GPIOs
  • Analog Peripherals - 12-bit 16-ch, 5 Msps ADC, 10-bit DAC
  • 3x Op-amps 2x Comparators, Temp Sensor, 8 capacitive touch sensor inputs

High Level of Security

  • QSPI Encrypted eXecute In Place from Flash
  • TRNG
  • Root of trust (PUF)
  • Secure Boot & OTA
  • Advanced Cryptographic Accelerators
  • Secure Key Storage, Debug Lock, Anti Rollback and Secure Attestation

Ultra-Low System Power Consumption

  • Wi-Fi Standby Associated mode current: 65 μA @ 1-second interval
  • Deep sleep current ~ 2.5 μA, Sleep/Standby current (RAM retention)  ~ 10 μA
  • Low MCU Sub-system active current: 32 μA/MHz in LP mode

Matter

  • Matter over Wi-Fi with Bluetooth LE commissioning

Software and Protocol Support

  • Integrated Wi-Fi stack, off loaded TCP/IP stack, Bluetooth stack supporting wireless coexistence
  • Support for Embedded Client mode, Access Point mode (up to 8 clients), Concurrent Wi-Fi and Bluetooth LE mode
  • Supports advanced Wi-Fi and Networking security features: WPA, WPA2 (Personal/Enterprise), WPA3 (Personal)
  • Integrated TCP/IP stack supports HTTP/HTTPS, DHCP, SSL/TLS1.3, MQTT
  • Wireless firmware upgrade and provisioning
  • Supports both hosted (Radio Co-Processor (RCP), and Network Co-processor (NCP) modes and host-less (SoC) modes

Operating Conditions

  • Single supply: 3.3 V
  • Dual supply: 3.3 V and 1.8 V
  • Operating temperature: -40 °C to +85 °C  

Package Size

  • QFN: 7.00 mm x 7.00 mm x 0.85 mm

Development Environment

  • Simplicity Studio v5
  • VS Code GitHub
Find the Right SiWx917 Device Select Columns
Select Columns
Part Number Wi-Fi Version Frequency Bands (GHz) Application MCU Integrated Stack Host Interfaces Flash RAM PSRAM Bluetooth Version
Wi-Fi 6 Single Band (2.4) Wireless, Networking SDIO, SPI 8192 672 5.4
Wi-Fi 6 Single Band (2.4) Wireless, Networking SDIO, SPI 4096 672 External 5.4
Wi-Fi 6 Single Band (2.4) Wireless, Networking SDIO, SPI 8192 672 External 5.4
Wi-Fi 6 Single Band (2.4) Wireless, Networking SDIO, SPI 672 External 5.4
Wi-Fi 6 Single Band (2.4) Wireless, Networking SDIO, SPI 672 2046 5.4
Wi-Fi 6 Single Band (2.4) Wireless, Networking SDIO, SPI 672 8192 5.4
Wi-Fi 6 Single Band (2.4) Wireless, Networking SDIO, SPI, UART 4096 672 5.4
Wi-Fi 6 Single Band (2.4) SDIO 5.4

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Whitepaper

Harnessing the Power of Wi-Fi 6 in the New Age of IoT

This whitepaper covers the rapid evolution of Wi-Fi over the last two decades and dive into the value of Wi-Fi 6 for IoT devices.

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